New technology of three-dimensional small treatment -- DEM technology research

If 5 μ M engraves the silicon small structure that corrode gives to serve as a mould directly with depth, because silicon itself is more fragile, very easy in mould pressing process broken, cannot use silicon mould to undertake the big batch of small structure parts of an apparatus is produced so. But can use this mould to be opposite plastic undertake small lot is machined (be less than) 10 times. Graph the electric lens photograph of the matrix of 2 plastic small gear that pass mould pressing to obtain to serve as small duplicate mould with silicon. Ply of this small gear matrix is 100 μ M, attainable metal is small after passing small electroform technology gear. The craft line with DEM at present main technique is to use silicon depth to engrave corrode craft to obtain first profound wide smaller than silicon structure. Obtain a metal through small electroform craft next small duplicate mould, apply small duplicate craft to undertake the batch of small parts of an apparatus is produced finally. Graph the 3 craft courses that gave out to use silicon depth to engrave corrode craft to have DEM technology. The low block silicon chip that passes in oxidation above all (resistor rate ＜ is splashed on 1 Ω Cm) shoot film of attack by surprise of a metal, use ultraviolet light is engraved and quarter corrode craft wins film of attack by surprise, the ICP that uses production of British STS company next engraves corrode machine to undertake to silicon depth engraves corrode, repass oxidation and reaction ion engrave corrode to undertake is isolated from protective to the sidewall of silicon. After using craft of deep-seated small electroform to undertake metallic nickel electroform, potassium of reoccupy hydrogen oxidation corrodes silicon chip, obtain the small duplicate pattern that constitutes by metallic nickel. Use this mould to be able to be opposite plastic undertake mould pressing is machined, undertake the batch of plastic product is produced, or undertake small electroform the 2nd times again to the plastic small structure that acquires after mould pressing, can undertake the batch of metallic product is produced. Because silicon is semiconductor, the key of this craft is to should resolve the technical crisis that has small electroform directly from silicon. 2 results and discuss line of DEM technology craft is at present entire already get through, the mould pressing of small duplicate mould that already made with this technology went out profound wide than plastic small structure. Graph 4 it is the ICP that uses STS company production quarter corrode machine is engraved those who go out is profound wide photograph of lens of report of smaller than silicon gear, gear ply is 100 μ M, reference circle diameter is 87 μ M, bore diameter is 25 μ M, modulus is less than 0.

01. The smallest modulus is the gear that can gain with accurate machining technology at present 0.

04, and cannot undertake mass-produced. The electroform of metallic nickel is relatively at present mature, and nickel has certain hardness and corrosion resistance can, suit quite as mould material. Graph the 5 metallic nickel that obtain to pass small electroform technology are small photograph of lens of report of small construction of duplicate mould metal, this small structure line is broad it is respectively 5, 10, 20 with 30 μ M, ply is 102 μ M, deep wide than be more than 20. Small duplicate craft basically has Nextpage mould pressing and note model two kinds of craft, treatment of mould pressing craft is periodic and longer (make an appointment with 10-20 minute) , but material changes convenient, and can undertake multilayer and different plastic mould pressing, apply to undertake science studies; The craft that note model machines cycle weak point, lowest can shrink to 10 seconds less than, but it is difficult that material changes, apply to undertake batch is produced. The mould pressing device that we use Germany to import is right polyvinyl chloride (PVC) , polystyrene (PS) , get together methylic acrylic acid armour ester (PMk4A) , polycarbonate (PC) and polyformaldehyde (POM) plastic the research that had small duplicate technology, among them PVC and PS material have not see document reports at present. Graph 6 it is the PMMA that obtains with mould pressing craft photograph of lens of report of plastic small construction, small structure height is 90 μ M, the line is broad for 30 μ M. "SJTU " the English abbreviate that is Shanghai traffic university. Carry the preliminary research of DEM technology, already obtained now a few profound wide compared metal and plastic small structure, but its are overall quality still needs to rise further. The issue that still needs to solve at present has: (1) is in small electroform craft, because silicon is semiconductor, itself conductivity is not tall, although chose low block silicon chip, splash in silicon chip the reverse side shot a metal, but its resistor rate and metallic photograph are compared very tall still, cause small electroform difficulty; (2) is in deep aperture, deep chamfer, the metallic ion that uses up cannot get complement very quickly, make the generation in the metallic small structure that electroform gives more poriferous unoccupied place, in the mould in mould pressing process easy generation ruptures. Foreground of industrialization of 3 DEM technology in last few years, from worldwide in light of, the research of system of personal computer cable and its industrialization development are very rapid, applied domain also is versed in to communication, machinery from domain of car, medical treatment Cheng and process automation expand gradually. The analysis that occupies abroad shows [10] , to 2002, the production value of product of small system technology will be achieved 384. 900 million dollar. Of the market big, make a new economic point of growth very likely. Study from the technology the current situation will look, the difference that our country is in the technical level of this domain and world is not big, but industrialization still is at present 0. Accordingly, accelerate the industrialization extremely urgent of product of technology of system of Electromechanical of our country miniature. At present the processing technique of product of technology of system of Electromechanical of our country miniature basically has two kinds: Silicon is small processing technique and LIGA technology. But these two kinds of processing technique are in large-scale those who use product of technology of Yu Wei system create the difficulty with go up to all have certain. Silicon is small processing technique cost is high, and apply to silicon material only, although LlIGA technology machines data side wide, profound wide than also excel other processing technique, but LIGA processing technique is restricted in industrialization respect by equipment respect huge. Photograph of small processing technique compares DEM technology and silicon, range of its treatment material is wide, can machine silicon material to also can process the data that be not silicon already, include metal, plastic, pottery and porcelain to wait, treatment deepness and deep wide smaller than waiting for function index and silicon processing technique is same, but its are plastic the price of the product has silicon only the L ／ of small processing technique 100. DEM technology and LIGA technology photograph are compared, can process as same as LIGA technology data, although its treatment deepness is mixed deep wide than not as good as LIGA technology, but major MEMS product does not need so tall deep wide compare and ply, and be below the premise with contiguous property, DKM technology is having extremely strong industrialization dominant position: The price is low, treatment cycle is short, maneuverability is strong, as better as microelectronics technology compatibility. Accordingly, DEM technology can replace LIGA technology to process product of system of cable of major personal computer in industrialization respect. The industrialization of DEM processing technique removes the industrialization of system of small to our country Electromechanical to urge action actively. 4 conclusion carry the preliminary research of DEM technology, the mould pressing of small duplicate mould that already made with this technology at present went out profound wide than plastic small structure. The craft line that proves this technology is practical. DEM technology made full use of body silicon is small the advantage of processing technique and LIGA technology, settled the limit that body silicon can process silicon data only in small processing technique. Compare with LIGA technology photograph, this technology does not need pattern plate of costly synchronous radiate illuminant and cover of light of especially other X. Its machine cycle weak point, the price is low, have maneuverability, the compatibility with microelectronics technology is better. The development of this technology is successful, remove the industrialization to system of Electromechanical of our country miniature to urge action very well. CNC Milling CNC Machining